Severing refers to processes in which something is cut off from the workpiece. The final shape of the workpiece is already contained in its initial shape. In addition to a residual piece, this usually results in chips. Severing processes include:

  • Severing according to DIN 8588 (shear cutting, tearing, splitting, breaking, wedge cutting, fracture cutting),
  • Chip removal using a geometrically defined cutting edge according to DIN 8589-0 (turning, drilling, countersinking, milling, planing, sawing, filing, etc.),
  • Chip removal using a geometrically indeterminate cutting edge according to DIN 8589-0 (grinding, honing, lapping, beam cutting, barrel polishing, etc.),
  • Removal operations according to DIN 8590 (laser blasting, plasma etching, laser cutting, chemical etching, electro-erosion, water jet cutting, etc.),
  • Disassembling according to DIN 8591 (disassembly, loosening of adhesive connections, desoldering, loosening of friction-locked connections, etc.),
  • Cleaning according to DIN 8592 (separation of unwanted layers from the workpiece surface (e.g., blast cleaning, brushing, ultrasonic cleaning, lye removal, flaming, etc.).